FEATURES:
Semi White Lined Un-CoatedPackaging ChipBoard designed for various low cost
applications. This board is an economical option for customers for use in non printing applications.
USES:
For economic moderate quality packagingsolution such as Match Inner Shells.
BOARD CONSTRUCTION
Coating
Size Coat - 2 g/m2
Top Layers
Layer 1 - None
Layer 2 - White Post Consumer Waste
Filler Layers
Layer 3 - Finer Recovered Waste
Layers 4, 5, 6 - Recovered Waste Paper
Bottom Layer
Layer 7 - Finer Recovered Waste
Sizing
Size Coat - 2 g/m2
Substance (GSM)
Caliper (microns)
Bulk (cc/gms)
Stiffness (mN)
MD
CD
180
216
1.20
26
10
200
240
1.20
48
20
230
278
1.21
66
26
250
308
1.23
120
48
285
350
1.25
165
66
300
375
1.25
191
76
320
400
1.25
211
84
350
441
1.26
261
104
380
486
1.28
342
136
400
520
1.30
402
161
450
590
1.31
482
193
Tolerance: ± 3%
Tolerance: ± 5%
Tolerance: ± 5%
Tolerance: ± 10%
Parameter
Unit
Value
Ply bond
J/m2
130 min
Smoothness (Bendsten)
Ml/min
280-320
Brightness
%
55 ( ±1)
Cobb Top (60)
GSM
30-50
Gloss at 75 deg
%
5.0 ( ± 1)
Moisture
%
6 .0 - 8.0
IGT
Mts/sec
Min 1.1
Tolerance:± 3%
Please note:
The tolerances are based upon 95% confidence limit and on laboratory results of random samples from mill.
The specifications are subject to change without any prior notice.
Cobb is measured such that the entire testing is completed in 60 seconds and whatman filter is used for testing.
