FEATURES:
White Lined Un-Coated Packaging Chip Board designed for various value oriented applications. This board is an economical option for customers for use in non printing
applications.
USES:
For economic yet high quality packaging solution the FMCG sector, Auto Industry, Textiles, Inner Liner of Shoe Boxes, Match Inner Shells, Inner Liner in Corrugated Boxes, Folding Box Boards – Mono Cartons etc.
BOARD CONSTRUCTION
Coating
Size Coat - 2 g/m2
Top Layers
Layer 1 - White Pre Consumer Waste
Layer 2 - White Post Consumer Waste
Filler Layers
Layer 3 - Finer Recovered Waste
Layers 4, 5, 6 - Recovered Waste Paper
Bottom Layer
Layer 7 - Finer Recovered Waste
Sizing
Size Coat - 2 g/m2
Substance (GSM)
Caliper (microns)
Bulk (cc/gms)
Stiffness (mN)
MD
CD
150
189
1.26
30
12
180
227
1.26
44
18
200
252
1.26
60
24
230
292
1.27
90
36
250
318
1.27
116
46
285
365
1.28
191
76
300
387
1.29
221
88
320
416
1.3
261
104
350
460
1.31
331
132
380
498
1.31
382
150
400
528
1.32
482
191
450
594
1.32
663
265
Tolerance: ± 3%
Tolerance: ± 5%
Tolerance: ± 5%
Tolerance: ± 10%
Tolerance: ± 10%
Parameter
Unit
Value
Ply bond
J/m2
130 min
Smoothness (Bendsten)
Ml/min
280-320
Brightness
%
70 ( ±1)
Cobb Top (60)
GSM
30-50
Gloss at 75 deg
%
6 ( ± 1)
Moisture
%
6 .0 - 8.0
IGT
Mts/sec
Min 1.1
Tolerance:± 3%
Please note:
The tolerances are based upon 95% confidence limit and on laboratory results of random samples from mill.
The specifications are subject to change without any prior notice.
Cobb is measured such that the entire testing is completed in 60 seconds and whatman filter is used for testing.
