FEATURES:
Rigid board is manufactured by laminating two or more layers of grey chip board with high strength glue to the desired thickness.This board is available in sheet form.
USES:
For use as a substrate or baseboard in lamination with metallic film/paper and subsequent printing on film applications. This is used in the manufacture if gift boxes, smartphone packaging boxes etc.
BOARD CONSTRUCTION
Layer 1
300 to 400 gsm Grey Chip Board.
Layer 2
High Strength Glue.
Layer 3
300 to 400 gsm Grey Chip Board.
Layers..
Repetition of Glue and Grey Chip Board Based on the required thickness.
Substance (GSM)
Caliper (microns)
Bulk (cc/gms)
Stiffness (mN)
MD
CD
200
256
1.28
64
26
230
299
1.3
80
32
250
328
1.31
116
46
285
376
1.32
197
78
300
399
1.33
227
90
320
405
1.35
271
108
350
472
1.35
346
138
380
513
1.35
402
161
400
560
1.36
502
201
450
630
1.36
683
273
Tolerance: ± 3%
Tolerance: ± 5%
Tolerance: ± 5%
Tolerance: ± 10%
Parameter
Unit
Value
Ply bond
J/m2
130 min
Smoothness (Bendsten)
Ml/min
320-360
Brightness
%
45 ( ±1)
Cobb Top (60)
GSM
30-50
Gloss at 75 deg
%
4.0 ( ± 1)
Moisture
%
6 .0 - 8.0
IGT
Mts/sec
Min 1.1
Tolerance:± 3%
Please note:
The tolerances are based upon 95% confidence limit and on laboratory results of random samples from mill.
The specifications are subject to change without any prior notice.
Cobb is measured such that the entire testing is completed in 60 seconds and whatman filter is used for testing.